Omar, Wahid (2016) Letter of Agreement signing ceremony between Universiti Teknologi Malaysia and University Of Applied Sciences Northwestern Switzerland. [Image] (Unpublished)
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Abstract
Letter of Agreement signing ceremony between Universiti Teknologi Malaysia and University Of Applied Sciences Northwestern Switzerland held at Seminar Hall, Menara Razak, UTM Kuala Lumpur. The agreement was witnessed by Yang Berhormat Dato’ Dr. Abu Bakar bin Mohamad Diah, Deputy Minister, Malaysian Ministry of Science, Technology and Innovation and His Excellency Michael Winzap, Ambassador of Switzerland. Through this collaboration, both UTM and FHNW will contribute towards many significant activities, primarily on the promotion of knowledge transfer and exchange between both institutions, and especially to potential entrepreneurs out there.
| Item Type: | Image |
|---|---|
| Additional Information: | As indicated in facebook |
| Uncontrolled Keywords: | UTM Vice Chancellor |
| Subjects: | L Education > LB Theory and practice of education L Education > LB Theory and practice of education > LB2300 Higher Education |
| Depositing User: | Salina Shamsuri |
| Date Deposited: | 29 Dec 2016 07:18 |
| Last Modified: | 12 Jan 2017 00:20 |
| URI: | http://odlsystem2.utm.my/id/eprint/166 |
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