Gallardo, Fausto (2012) Integrated circuit packaging. White Word Publications, Delhi, India. ISBN 978-81-323-4171-0
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Abstract
Integrated circuit packaging is the final stage of semiconductor device fabrication per se, followed by IC testing. In the integrated circuit industry it is called simply packaging and sometimes semiconductor device assembly, or simply assembly. Also, sometimes it is called encapsulation or seal, by the name of its last step, which might lead to confusion, because the term packaging generally comprises the steps or the technology of mounting and interconnecting of devices.
| Item Type: | Book |
|---|---|
| Subjects: | T Technology > TK Electrical engineering. Electronics Nuclear engineering |
| Depositing User: | Practical Student 02 |
| Date Deposited: | 08 Nov 2021 08:08 |
| Last Modified: | 26 Jul 2022 07:10 |
| URI: | http://odlsystem2.utm.my/id/eprint/2606 |
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